In a move likely to move the needle on the emergence of Wi-Fi 7 product use, Qualcomm launched an AI-optimized chipset for the latest version of the wireless specification this week.
Announced at the Mobile World Congress (MWC) 2024 global mobile event in Barcelona this week, the Fast Connect 7900 chipset can be used in products that support Wi-Fi 7 later this year, according to the company.
The chipset leverages AI to set a higher level for high performance, low latency, and lower power connectivity, in part by integrating Wi-Fi, Bluetooth, and Ultra-Wideband (UWB) on a single chip. This supports digital key, object finding, and indoor navigation.
